MC34063A, MC33063A
SOEIAJ–8
M SUFFIX
PLASTIC PACKAGE
CASE 968–01
ISSUE O
8
5
LE
Q1
E HE
M
°
1
4
L
DETAIL P
Z
D
e
P
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER
3. DIMENSION D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED AT
THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT MINIMUM SPACE BETWEEN
PROTRUSIONS AND ADJACENT LEAD TO BE 0.46
(0.018).
DIM
A
A1
b
c
D
E
e
HE
L
LE
M
Q1
Z
MILLIMETERS
MIN
MAX
---
2.05
0.05
0.20
0.35
0.50
0.18
0.27
5.10
5.50
5.10
5.45
1.27 BSC
7.40
8.20
0.50
0.85
1.10
1.50
0
°
10
°
0.70
0.90
---
0.94
INCHES
MIN
MAX
---
0.081
0.002
0.008
0.014
0.020
0.007
0.011
0.201
0.217
0.201
0.215
0.050 BSC
0.291
0.323
0.020
0.033
0.043
0.059
0
°
10
°
0.028
0.035
---
0.037
b
0.13 (0.005)
M
A1
c
0.10 (0.004)
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ONSEMI [ ON SEMICONDUCTOR ]
