MC34063A MC33063A
OUTLINE DIMENSIONS
P, P1 SUFFIX
PLASTIC PACKAGE
CASE 626–05
ISSUE K
8
5
4
NOTES:
–B–
1. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
2. PACKAGE CONTOUR OPTIONAL (ROUND OR
1
SQUARE CORNERS).
3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
F
MILLIMETERS
INCHES
–A–
NOTE 2
DIM
A
B
C
D
F
G
H
J
K
L
M
N
MIN
9.40
6.10
3.94
0.38
1.02
MAX
10.16
6.60
4.45
0.51
1.78
MIN
MAX
L
0.370
0.240
0.155
0.015
0.040
0.400
0.260
0.175
0.020
0.070
C
2.54 BSC
0.100 BSC
1.27
0.30
3.43
0.030
0.008
0.115
0.050
0.012
0.135
0.76
0.20
2.92
J
–T–
SEATING
PLANE
N
7.62 BSC
0.300 BSC
M
—
—
10°
10
°
D
K
0.030
0.76
1.01
0.040
G
H
M
M
M
0.13 (0.005)
T
A
B
D SUFFIX
PLASTIC PACKAGE
CASE 751–05
(SO–8)
ISSUE P
NOTES:
–A–
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
8
1
5
4X P
–B–
M
M
0.25 (0.010)
B
4
MILLIMETERS
INCHES
DIM
A
B
C
D
MIN
4.80
3.80
1.35
0.35
0.40
MAX
5.00
4.00
1.75
0.49
1.25
MIN
MAX
0.196
0.157
0.068
0.019
0.049
0.189
0.150
0.054
0.014
0.016
R X 45
F
C
F
SEATING
–T–
PLANE
G
J
K
M
P
R
1.27 BSC
0.050 BSC
K
J
M
0.18
0.10
0
0.25
0.25
7
0.007
0.004
0
0.009
0.009
7
8X D
0.25 (0.010)
M
S
S
T
B
A
5.80
0.25
6.20
0.50
0.229
0.010
0.244
0.019
10
MOTOROLA ANALOG IC DEVICE DATA
ONSEMI [ ONSEMI ]
