MC33275, NCV33275
PIN CONNECTIONS
GND
4
GND
4
1
8
Input
GND
GND
N/C
Output
GND
GND
N/C
Input
Input
Input
N/C
8
7
6
5
Output
N/C
1
2
3
4
2
3
4
7
6
5
GND
N/C
1
2
3
1
2
3
V
in
GND V
out
GND
V
V
out
in
Pins 4 and 5 Not Connected
MC33275D
MC33275DT
MC33275ST
MC33275MN
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Input Voltage
V
CC
13
Vdc
Power Dissipation and Thermal Characteristics
T = 25°C
A
P
D
Internally Limited
W
Maximum Power Dissipation
Case 751 (SOIC−8) D Suffix
R
R
160
25
°C/W
°C/W
Thermal Resistance, Junction−to−Ambient
Thermal Resistance, Junction−to−Case
Case 318E (SOT−223) ST Suffix
Thermal Resistance, Junction−to−Air
Thermal Resistance, Junction−to−Case
Case 369A (DPAK−3) DT Suffix
Thermal Resistance, Junction−to−Air
Thermal Resistance, Junction−to−Case
Case 488AF (DFN−8, 4x4) MN Suffix
ꢁ
JA
ꢁ
JC
245
15
°C/W
°C/W
R
R
ꢁ
JA
JC
ꢁ
92
6.0
°C/W
°C/W
R
R
ꢁ
JA
JC
ꢁ
183
93
9.0
°C/W
°C/W
°C/W
R
R
Thermal Resistance, Junction−to−Air (with 1.0 oz PCB cu area)
Thermal Resistance, Junction−to−Air (with 1.8 oz PCB cu area)
Thermal Resistance, Junction−to−Case
ꢁ
ꢁ
JA
JA
psi−JC*
Output Current
I
300
mA
°C
°C
°C
V
O
Maximum Junction Temperature
Operating Ambient Temperature Range
Storage Temperature Range
T
T
150
J
− 40 to +125
− 65 to +150
A
T
stg
Electrostatic Discharge Sensitivity (ESD)
Human Body Model (HBM)
Machine Model (MM)
ESD
4000
400
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
*“C’’ (“case’’) is defined as the solder−attach interface between the center of the exposed pad on the bottom of the package, and the board to
which it is attached.
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