MC34071,2,4,A MC33071,2,4,A, NCV33074A
P D, MAXIMUM POWER DISSIPATION (mW)
2400
V IO , INPUT OFFSET VOLTAGE (mV)
V
4.0
2.0
0
2000
1600
SOIC−14 Pkg
1200
800
400
0
−55 −40 −20
SOIC−8 Pkg
8 & 14 Pin Plastic Pkg
V
CC
= +15 V
V
EE
= −15 V
V
CM
= 0
−2.0
−4.0
−55
−25
0
25
50
75
100
125
0
20
40
60
80
100 120 140 160
T
A
, AMBIENT TEMPERATURE (°C)
T
A
, AMBIENT TEMPERATURE (°C)
Figure 4. Maximum Power Dissipation versus
Temperature for Package Types
V ICR , INPUT COMMON MODE VOLTAGE RANGE (V)
I IB, INPUT BIAS CURRENT (NORMALIZED)
Figure 5. Input Offset Voltage versus
Temperature for Representative Units
V
CC
V
CC
V
CC
−0.8
V
CC
−1.6
V
CC
−2.4
V
EE
+0.01
V
EE
V
EE
−55
−25
0
25
50
75
100
125
V
CC
/V
EE
= +1.5 V/ −1.5 V to +22 V/ −22 V
1.3
1.2
1.1
1.0
0.9
0.8
0.7
−55
V
CC
= +15 V
V
EE
= −15 V
V
CM
= 0
−25
0
25
50
75
100
125
T
A
, AMBIENT TEMPERATURE (°C)
T
A
, AMBIENT TEMPERATURE (°C)
Figure 6. Input Common Mode Voltage
Range versus Temperature
Figure 7. Normalized Input Bias Current
versus Temperature
I IB, INPUT BIAS CURRENT (NORMALIZED)
1.4
VO, OUTPUT VOLTAGE SWING (V )
pp
V
CC
= +15 V
V
EE
= −15 V
T
A
= 25°C
50
40
30
R
L
= 10 k
20
10
0
−12
−8.0
−4.0
0
4.0
8.0
12
0
5.0
10
15
20
25
V
IC
, INPUT COMMON MODE VOLTAGE (V)
V
CC
, |V
EE
|, SUPPLY VOLTAGE (V)
R
L
= 2.0 k
R
L
Connected
to Ground T
A
= 25°C
1.2
1.0
0.8
0.6
Figure 8. Normalized Input Bias Current versus
Input Common Mode Voltage
Figure 9. Split Supply Output Voltage
Swing versus Supply Voltage
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