MBRS240LT3
Surface Mount
Schottky Power Rectifier
SMB Power Surface Mount Package
These devices employ the Schottky Barrier principle in a
metal−to−silicon power rectifier. Features epitaxial construction with
oxide passivation and metal overlay contact. Ideally suited for low
voltage, high frequency switching power supplies; free wheeling
diodes and polarity protection diodes.
Features
http://onsemi.com
SCHOTTKY BARRIER
RECTIFIER
2.0 AMPERES, 40 VOLTS
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Compact Package with J−Bend Leads Ideal for Automated Handling
Highly Stable Oxide Passivated Junction
Guard−Ring for Overvoltage Protection
Low Forward Voltage Drop
Pb−Free Package is Available
Mechanical Characteristics
SMB
CASE 403A
PLASTIC
Case: Molded Epoxy
Epoxy Meets UL 94 V−0 @ 0.125 in
Weight: 95 mg (Approximately)
Cathode Polarity Band
Maximum Temperature of 260°C/10 Seconds for Soldering
Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
MARKING DIAGRAM
AYWW
2BL4G
G
2BL4
= Specific Device Code
A
= Assembly Location
Y
= Year
WW
= Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
MAXIMUM RATINGS
Rating
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Average Rectified Forward Current
(At Rated V
R
, T
C
= 100°C)
Peak Repetitive Forward Current
(At Rated V
R
, Square Wave,
20 kHz, T
C
= 105°C)
Non−Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions
Halfwave, Single Phase, 60 Hz)
Storage/Operating Case Temperature
Operating Junction Temperature
Voltage Rate of Change
(Rated V
R
, T
J
= 25°C)
Symbol
V
RRM
V
RWM
V
R
I
O
I
FRM
Value
40
Unit
V
2.0
4.0
A
A
ORDERING INFORMATION
Device
MBRS240LT3
Package
SMB
SMB
(Pb−Free)
Shipping
†
2500/Tape & Reel
2500/Tape & Reel
I
FSM
25
A
MBRS240LT3G
T
stg
, T
C
T
J
dv/dt
−55
to +150
−55
to +150
10,000
°C
°C
V/ms
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
©
Semiconductor Components Industries, LLC, 2008
November, 2008
−
Rev. 5
1
Publication Order Number:
MBRS240LT3/D
ONSEMI [ ON SEMICONDUCTOR ]
