MBRS140T3
Preferred Device
Surface Mount
Schottky Power Rectifier
Schottky Power Rectifiers employ the use of the Schottky Barrier
principle in a large area metal−to−silicon power diode.
State−of−the−art geometry features epitaxial construction with oxide
passivation and metal overlay contact. Ideally suited for low voltage,
high frequency rectification, or as free wheeling and polarity
protection diodes in surface mount applications where compact size
and weight are critical to the system.
Features
http://onsemi.com
•
•
•
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SCHOTTKY BARRIER
RECTIFIER
1.0 AMPERE, 40 VOLTS
Small Compact Surface Mountable Package with J−Bend Leads
Rectangular Package for Automated Handling
Highly Stable Oxide Passivated Junction
Very Low Forward Voltage Drop
(0.55 V Max @ 1.0 A, T
J
= 25°C)
•
Excellent Ability to Withstand Reverse Avalanche Energy Transients
•
Guardring for Stress Protection
•
Pb−Free Package is Available
Mechanical Characteristics
SMB
CASE 403A
PLASTIC
•
Case: Epoxy, Molded
•
Weight: 95 mg (approximately)
•
Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
•
Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
•
Cathode Polarity Band
MAXIMUM RATINGS
Rating
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Average Rectified Forward Current
T
L
= 115°C
Non−Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions
Halfwave, Single Phase, 60 Hz)
Operating Junction Temperature
Symbol
V
RRM
V
RWM
V
R
I
F(AV)
I
FSM
Value
40
Unit
V
MARKING DIAGRAM
AYWW
B14
G
G
B14
A
Y
WW
G
= Device Code
= Assembly Location
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
1.0
40
A
A
Device
MBRS140T3
MBRS140T3G
Package
SMB
SMB
(Pb−Free)
Shipping
†
2500/Tape & Reel
2500/Tape & Reel
T
J
−65 to +125
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Preferred
devices are recommended choices for future use
and best overall value.
©
Semiconductor Components Industries, LLC, 2007
1
February, 2007 − Rev. 7
Publication Order Number:
MBRS140T3/D