NCP1546
R6
10k
D1
L1
27
mH
Vout (3.3 V)
C1
1
mF
U1
EPAD
Vsw
SHDNB
NC
NC
NC
NC
SYNC
GND
Vin
BOOST
NC
NC
NC
NC
Vc
Vfb
Vin (7 V to 16 V)
C5
0.1
mF
+ C2
330
mF
C4
0.1
mF
R3
205
C3
100
mF
+
D2
NCP1546
R2
127
SHDNB
SYNC
Figure 1. Application Diagram, 4.5 V − 16 V to 3.3 V @ 1.0 A Converter
MAXIMUM RATINGS*
Rating
Peak Transient Voltage (31 V Load Dump @ V
IN
= 14 V)
Operating Junction Temperature Range, T
J
Lead Temperature Soldering:
Storage Temperature Range, T
S
ESD
(Human Body Model)
(Machine Model)
(Charge Device Model)
18−Lead DFN Junction−to−Ambient, R
qJA
Reflow: (Note 1)
Value
45
0 to +125
240 peak
(Note 2)
−65 to +150
2.0
200
>1.0
16
Unit
V
°C
°C
°C
kV
V
kV
°C/W
Package Thermal Resistance
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
*The maximum package power dissipation must be observed.
1. 60 second maximum above 183°C.
2. −5°C/0°C allowable conditions.
MAXIMUM RATINGS
(Voltages are with respect to GND)
Pin Name
V
IN
(DC)*
BOOST
V
SW
V
C
SHDNB
SYNC
V
FB
*See table above for load dump.
V
Max
40 V
40 V
40 V
7.0 V
7.0 V
7.0 V
7.0 V
V
MIN
−0.3 V
−0.3 V
−0.6 V/−1.0 V, t < 50 ns
−0.3 V
−0.3 V
−0.3 V
−0.3 V
I
SOURCE
N/A
N/A
4.0 A
1.0 mA
1.0 mA
1.0 mA
1.0 mA
I
SINK
4.0 A
100 mA
10 mA
1.0 mA
1.0 mA
1.0 mA
1.0 mA
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