MBR0520LT1, MBR0520LT3
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V
20
V
RRM
V
RWM
V
R
Average Rectified Forward Current
I
0.5
5.5
A
A
F(AV)
(Rated V , T = 90°C)
R
L
Non−Repetitive Peak Surge Current
I
FSM
(Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz)
Storage Temperature Range
T
−65 to +150
−65 to +125
1000
°C
°C
stg
Operating Junction Temperature
T
J
Voltage Rate of Change (Rated V )
dv/dt
V/ms
V
R
ESD Ratings:
Machine Model = C
> 400
Human Body Model = 3B
> 8000
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
THERMAL CHARACTERISTICS
Rating
Thermal Resistance; Junction−to−Ambient (Note 1)
Thermal Resistance; Junction−to−Lead
Symbol
Value
206
Unit
°C/W
°C/W
R
q
JA
R
150
q
JL
ELECTRICAL CHARACTERISTICS
v
T = 25°C
J
T = 100°C
J
V
Maximum Instantaneous Forward Voltage (Note 2)
F
(i = 0.1 Amps)
0.300
0.385
0.220
0.330
F
(i = 0.5 Amps)
F
I
R
T = 25°C
J
T = 100°C
J
mA
Maximum Instantaneous Reverse Current (Note 2)
(V = 10 V)
75 mA
250 mA
5 mA
8 mA
R
(Rated DC Voltage = 20 V)
1. 1 inch square pad size (1 x 0.5 inch for each lead) on FR4 board.
2. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2%.
http://onsemi.com
2
ONSEMI [ ONSEMI ]
