LM339, LM239, LM2901, LM2901V, NCV2901, MC3302
PACKAGE DIMENSIONS
TSSOP−14
CASE 948G−01
ISSUE B
14X
K
REF
0.10 (0.004)
0.15 (0.006) T U
S
M
T U
S
V
S
N
2X
L/2
14
8
0.25 (0.010)
M
L
PIN 1
IDENT.
1
7
B
−U−
N
F
DETAIL E
K
K1
J J1
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL
IN EXCESS OF THE K DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
MILLIMETERS
INCHES
MIN
MAX
MIN MAX
4.90
5.10 0.193 0.200
4.30
4.50 0.169 0.177
−−−
1.20
−−− 0.047
0.05
0.15 0.002 0.006
0.50
0.75 0.020 0.030
0.65 BSC
0.026 BSC
0.50
0.60 0.020 0.024
0.09
0.20 0.004 0.008
0.09
0.16 0.004 0.006
0.19
0.30 0.007 0.012
0.19
0.25 0.007 0.010
6.40 BSC
0.252 BSC
0
_
8
_
0
_
8
_
0.15 (0.006) T U
S
A
−V−
SECTION N−N
−W−
C
0.10 (0.004)
−T−
SEATING
PLANE
D
G
H
DETAIL E
SOLDERING FOOTPRINT*
7.06
1
14X
0.36
14X
1.26
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
11
ÉÉÉ
ÇÇÇ
ÉÉÉ
ÇÇÇ
0.65
PITCH
DIMENSIONS: MILLIMETERS
ONSEMI [ ON SEMICONDUCTOR ]
