LM337
MAXIMUM RATINGS
(T
A
= +25°C, unless otherwise noted)
Rating
Input−Output Voltage Differential
Power Dissipation
Case 221A
T
A
= +25°C
Thermal Resistance, Junction−to−Ambient
Thermal Resistance, Junction−to−Case
Case 936 (D
2
PAK)
T
A
= +25°C
Thermal Resistance, Junction−to−Ambient
Thermal Resistance, Junction−to−Case
Operating Junction Temperature Range
Storage Temperature Range
Symbol
V
I
−V
O
Value
40
Unit
Vdc
P
D
q
JA
q
JC
P
D
q
JA
q
JC
T
J
T
stg
Internally Limited
65
5.0
Internally Limited
70
5.0
−40 to +125
−65 to +150
W
°C/W
°C/W
W
°C/W
°C/W
°C
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
ELECTRICAL CHARACTERISTICS
(|V
I−
V
O
| = 5.0 V; I
O
= 0.5 A for T package; T
J
= T
low
to T
high
[Note 1]; I
max
and P
max
[Note 2].)
Characteristics
Line Regulation (Note 3), T
A
= +25°C, 3.0 V
≤
|V
I
−V
O
|
≤
40 V
Load Regulation (Note 3), T
A
= +25°C, 10 mA
≤
I
O
≤
I
max
|V
O
|
≤
5.0 V
|V
O
|
≥
5.0 V
Thermal Regulation, T
A
= +25°C (Note 5), 10 ms Pulse
Adjustment Pin Current
Adjustment Pin Current Change, 2.5 V
≤
|V
I
−V
O
|
≤
40 V,
10 mA
≤
I
L
≤
I
max
, P
D
≤
P
max
, T
A
= +25°C
Reference Voltage, T
A
= +25°C, 3.0 V
≤
|V
I
−V
O
|
≤
40 V,
10 mA
≤
I
O
≤
I
max
, P
D
≤
P
max
, T
J
= T
low
to T
high
Line Regulation (Note 3), 3.0 V
≤
|V
I
−V
O
|
≤
40 V
Load Regulation (Note 3), 10 mA
≤
I
O
≤
I
max
|V
O
|
≤
5.0 V
|V
O
|
≥
5.0 V
Temperature Stability (T
low
≤
T
J
≤
T
high
)
Minimum Load Current to Maintain Regulation
(|V
I
−V
O
|
≤
10 V)
(|V
I
−V
O
|
≤
40 V)
Maximum Output Current
|V
I
−V
O
|
≤
15 V, P
D
≤
P
max
, T Package
|V
I
−V
O
|
≤
40 V, P
D
≤
P
max
, T
J
= +25°C, T Package
RMS Noise, % of V
O
, T
A
= +25°C, 10 Hz
≤
f
≤
10 kHz
Ripple Rejection, V
O
= −10 V, f = 120 Hz (Note 4)
Without C
Adj
C
Adj
= 10
mF
Long−Term Stability, T
J
= T
high
(Note 6), T
A
= +25°C for
Endpoint Measurements
Thermal Resistance, Junction−to−Case, T Package
4
3
1, 2
3
Figure
1
2
Symbol
Reg
line
Reg
load
−
−
Reg
therm
I
Adj
DI
Adj
V
ref
−
−
−
−1.21
3
−1.20
−
−
−
3
3
T
S
I
Lmin
−
−
3
I
max
−
−
N
RR
−
66
3
S
R
qJC
−
−
60
77
0.3
4.0
−
−
1.0
−
%/1.0 k
Hrs.
°C/W
−
1.5
0.15
0.003
2.2
0.4
−
% V
O
dB
1.5
2.5
6.0
10
A
−
15
0.3
0.003
65
2.0
−1.25
0
−1.25
0.02
20
0.3
0.6
50
1.0
0.04
100
5.0
−1.28
7
−1.30
0.07
70
1.5
−
mV
% V
O
% V
O
/W
mA
mA
V
Min
−
Typ
0.01
Max
0.04
Unit
%/V
1
2
Reg
line
Reg
load
%/V
mV
% V
O
% V
O
mA
1. T
low
to T
high
= 0° to +125°C, for LM337T, D2T. T
low
to T
high
= − 40° to +125°C, for LM337BT, BD2T.
2. I
max
= 1.5 A, P
max
= 20 W
3. Load and line regulation are specified at constant junction temperature. Change in V
O
because of heating effects is covered under the
Thermal Regulation specification. Pulse testing with a low duty cycle is used.
4. C
Adj
, when used, is connected between the adjustment pin and ground.
5. Power dissipation within an IC voltage regulator produces a temperature gradient on the die, affecting individual IC components on the die.
These effects can be minimized by proper integrated circuit design and layout techniques. Thermal Regulation is the effect of these
temperature gradients on the output voltage and is expressed in percentage of output change per watt of power change in a specified time.
6. Since Long Term Stability cannot be measured on each device before shipment, this specification is an engineering estimate of average
stability from lot to lot.
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