LM317M
MAXIMUM RATINGS
(T
A
= 25°C, unless otherwise noted.)
Rating
Input−Output Voltage Differential
Power Dissipation (Package Limitation) (Note 1)
Plastic Package, T Suffix, Case 221A
T
A
= 25°C
Thermal Resistance, Junction−to−Air
Thermal Resistance, Junction−to−Case
Plastic Package, DT Suffix, Case 369C
T
A
= 25°C
Thermal Resistance, Junction−to−Air
Thermal Resistance, Junction−to−Case
Plastic Package, ST Suffix, Case 318E
T
A
= 25°C
Thermal Resistance, Junction−to−Air
Thermal Resistance, Junction−to−Case
Operating Junction Temperature Range
Storage Temperature Range
Symbol
V
I
−V
O
Value
40
Unit
Vdc
P
D
q
JA
q
JC
P
D
q
JA
q
JC
P
D
q
JA
q
JC
T
J
T
stg
Internally Limited
70
5.0
Internally Limited
92
5.0
Internally Limited
245
15
−40 to +125
−65 to +150
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Figure 25 provides thermal resistance versus PC board pad size.
ELECTRICAL CHARACTERISTICS
(V
I
− V
O
= 5.0 V; I
O
= 0.1 A, T
J
= T
low
to T
high
(Note 2), unless otherwise noted.)
Characteristics
Line Regulation (Note 3) (T
A
= 25°C, 3.0 V
≤
V
I
− V
O
≤
40 V)
Load Regulation (Note 3)
T
A
= 25°C, 10 mA
≤
I
O
≤
0.5 A
V
O
≤
5.0 V
V
O
≥
5.0 V
Adjustment Pin Current
Adjustment Pin Current Change
2.5 V
≤
V
I
− V
O
≤
40 V, 10 mA
≤
I
L
≤
0.5 A, P
D
≤
P
max
Reference Voltage
3.0 V
≤
V
I
− V
O
≤
40 V, 10 mA
≤
I
L
≤
0.5 A, P
D
≤
P
max
Line Regulation (Note 3)
3.0 V
≤
V
I
−V
O
≤
40 V
Load Regulation (Note 3)
10 mA
≤
I
O
≤
0.5 A
V
O
≤
5.0 V
V
O
≥
5.0 V
Temperature Stability (T
low
≤
T
J
≤
T
high
)
Minimum Load Current to Maintain Regulation (V
I
− V
O
= 40 V)
Maximum Output Current
V
I
− V
O
≤
15 V, P
D
≤
P
max
V
I
− V
O
= 40 V, P
D
≤
P
max
, T
A
= 25°C
RMS Noise, % of V
O
(T
A
= 25°C, 10 Hz
≤
f
≤
10 kHz)
Ripple Rejection, V
O
= 10 V, f = 120 Hz (Note 4)
Without C
Adj
C
Adj
= 10
mF
Long−Term Stability, T
J
= T
high
(Note 5)
T
A
= 25°C for End−point Measurements
Figure
3
4
Symbol
Reg
line
Reg
load
−
−
5
3, 4
5
3
4
I
Adj
DI
Adj
V
ref
Reg
line
Reg
load
−
−
5
5
5
T
S
I
Lmin
I
max
0.5
0.15
−
6
N
RR
−
66
5
S
−
65
80
0.3
−
−
1.0
%/1.0
kHrs.
−
0.9
0.25
0.003
−
−
−
% V
O
dB
−
−
20
0.3
0.7
3.5
70
1.5
−
10
mV
% V
O
% V
O
mA
A
−
−
1.200
−
5.0
0.1
50
0.2
1.250
0.02
25
0.5
100
5.0
1.300
0.07
mV
% V
O
mA
mA
V
%/V
LM317M / LM317MB
Min
Typ
Max
−
0.01
0.04
Unit
%/V
2. T
low
to T
high
= 0° to +125°C for LM317M
T
low
to T
high
= − 40° to +125°C for LM317MB.
3. Load and line regulation are specified at constant junction temperature. Changes in V
O
due to heating effects must be taken into account
separately. Pulse testing with low duty cycle is used.
4. C
Adj
, when used, is connected between the adjustment pin and ground.
5. Since Long−Term Stability cannot be measured on each device before shipment, this specification is an engineering estimate of average
stability from lot−to−lot.
http://onsemi.com
2
ONSEMI [ ON SEMICONDUCTOR ]
