LM317L
MAXIMUM RATINGS
Rating
Input–Output Voltage Differential
Power Dissipation
Operating Junction Temperature Range
Storage Temperature Range
Symbol
VI–VO
PD
TJ
Tstg
Value
40
Internally Limited
–40 to +125
–65 to +150
Unit
Vdc
W
°C
°C
ELECTRICAL CHARACTERISTICS
(VI–VO = 5.0 V; IO = 40 mA; TJ = Tlow to Thigh [Note 1]; Imax and Pmax [Note 2];
unless otherwise noted.)
LM317L, LB
Characteristics
Line Regulation (Note 3)
TA = 25°C, 3.0 V
≤
VI – VO
≤
40 V
Load Regulation (Note 3), TA = 25°C
10 mA
≤
IO
≤
Imax – LM317L
VO
≤
5.0 V
VO
≥
5.0 V
Adjustment Pin Current
Adjustment Pin Current Change
2.5 V
≤
VI – VO
≤
40 V, PD
≤
Pmax
10 mA
≤
IO
≤
Imax – LM317L
Reference Voltage
3.0 V
≤
VI – VO
≤
40 V, PD
≤
Pmax
10 mA
≤
IO
≤
Imax – LM317L
Line Regulation (Note 3)
3.0 V
≤
VI – VO
≤
40 V
Load Regulation (Note 3)
10 mA
≤
IO
≤
Imax – LM317L
VO
≤
5.0 V
VO
≥
5.0 V
Temperature Stability (Tlow
≤
TJ
≤
Thigh)
Minimum Load Current to Maintain Regulation (VI – VO = 40 V)
Maximum Output Current
VI – VO
≤
6.25 V, PD
≤
Pmax, Z Package
VI – VO
≤
40 V, PD
≤
Pmax, TA = 25°C, Z Package
RMS Noise, % of VO
TA = 25°C, 10 Hz
≤
f
≤
10 kHz
Ripple Rejection (Note 4)
VO = 1.2 V, f = 120 Hz
CAdj = 10
µF,
VO = 10.0 V
Long Term Stability, TJ = Thigh (Note 5)
TA = 25°C for Endpoint Measurements
Thermal Resistance, Junction–to–Case
Z Package
Thermal Resistance, Junction–to–Air
Z Package
4
Figure
1
2
Symbol
Regline
Regload
–
–
3
1, 2
IAdj
∆I
Adj
–
–
5.0
0.1
50
0.2
25
0.5
100
5.0
mV
% VO
µA
µA
Min
–
Typ
0.01
Max
0.04
Unit
%/V
3
Vref
1.20
1.25
1.30
V
1
2
Regline
Regload
–
0.02
0.07
%/V
–
–
3
3
3
TS
ILmin
Imax
100
–
N
RR
60
–
3
S
R
θJC
R
θJA
–
–
–
–
–
–
20
0.3
0.7
3.5
200
20
0.003
70
1.5
–
10
–
–
–
mV
% VO
% VO
mA
mA
% VO
dB
80
80
0.3
83
160
–
–
1.0
–
–
%/1.0 k
Hrs.
°C/W
°C/W
NOTES:
1. Tlow to Thigh = 0° to +125°C for LM317L
–40° to +125°C for LM317LB
2. Imax = 100 mA
Pmax = 625 mW
3. Load and line regulation are specified at constant junction temperature. Changes in VO due to heating effects must be taken into account separately.
Pulse testing with low duty cycle is used.
4. CAdj, when used, is connected between the adjustment pin and ground.
5. Since Long–Term Stability cannot be measured on each device before shipment, this specification is an engineering estimate of average stability
from lot to lot.
2
MOTOROLA ANALOG IC DEVICE DATA
ONSEMI [ ON SEMICONDUCTOR ]
