LM317L
MAXIMUM RATINGS
Rating
Input−Output Voltage Differential
Power Dissipation
Case 29 (TO−92)
T
A
= 25°C
Thermal Resistance, Junction−to−Ambient
Thermal Resistance, Junction−to−Case
Case 751 (SOIC−8) (Note 1)
T
A
= 25°C
Thermal Resistance, Junction−to−Ambient
Thermal Resistance, Junction−to−Case
Operating Junction Temperature Range
Storage Temperature Range
Symbol
V
I
−V
O
Value
40
Unit
Vdc
P
D
R
qJA
R
qJC
Internally Limited
160
83
W
°C/W
°C/W
P
D
R
qJA
R
qJC
T
J
T
stg
Internally Limited
180
45
−40 to +125
−65 to +150
W
°C/W
°C/W
°C
°C
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
1. SOIC−8 Junction−to−Ambient Thermal Resistance is for minimum recommended pad size. Refer to Figure 23 for Thermal Resistance
variation versus pad size.
2. This device series contains ESD protection and exceeds the following tests:
Human Body Model, 2000 V per MIL STD 883, Method 3015.
Machine Model Method, 200 V.
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