LM317, NCV317
MAXIMUM RATINGS
Rating
Symbol
V −V
Value
Unit
Input−Output Voltage Differential
−0.3 to 40
Vdc
I
O
Power Dissipation
Case 221A
T = +25C
P
q
Internally Limited
W
C/W
C/W
A
D
JA
JC
Thermal Resistance, Junction−to−Ambient
Thermal Resistance, Junction−to−Case
65
5.0
q
2
Case 936 (D PAK−3)
T = +25C
Thermal Resistance, Junction−to−Ambient
Thermal Resistance, Junction−to−Case
P
q
Internally Limited
W
C/W
C/W
A
D
JA
JC
70
5.0
q
Operating Junction Temperature Range
Storage Temperature Range
T
−55 to +150
−65 to +150
C
C
J
T
stg
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
ELECTRICAL CHARACTERISTICS
(V −V = 5.0 V; I = 0.5 A for D2T and T packages; T = T
to T
(Note 1); I
and P
(Note 2); unless otherwise noted.)
I
O
O
J
low
high
max
max
Characteristics
Line Regulation (Note 3), T = +25C, 3.0 V V −V 40 V
Figure
Symbol
Min
Typ
Max
Unit
1
2
Reg
−
0.01
0.04
%/V
A
I
O
line
Load Regulation (Note 3), T = +25C, 10 mA I I
Reg
load
A
O
max
V
O
V
O
5.0 V
5.0 V
−
−
5.0
0.1
25
0.5
mV
% V
O
Thermal Regulation, T = +25C (Note 4), 20 ms Pulse
−
3
Reg
−
−
−
0.03
50
0.07
100
5.0
% V /W
A
therm
O
Adjustment Pin Current
I
mA
mA
Adj
Adjustment Pin Current Change, 2.5 V V −V 40 V,
1, 2
DI
0.2
I
O
Adj
10 mA I I
, P P
D max
L
max
Reference Voltage, 3.0 V V −V 40 V, 10 mA I I
, P P
D max
3
1
2
V
1.2
1.25
0.02
1.3
V
I
O
O
max
ref
Line Regulation (Note 3), 3.0 V V −V 40 V
Reg
−
0.07
% V
I
O
line
Load Regulation (Note 3), 10 mA I I
Reg
load
O
max
V
O
V
O
5.0 V
5.0 V
−
−
20
0.3
70
1.5
mV
% V
O
Temperature Stability (T T T
)
3
3
3
T
−
−
0.7
3.5
−
% V
low
J
high
S
O
Minimum Load Current to Maintain Regulation (V −V = 40 V)
I
Lmin
10
mA
A
I
O
Maximum Output Current
V −V 15 V, P P T Package
max,
I
max
1.5
0.15
2.2
0.4
−
−
I
O
D
V −V = 40 V, P P
, T = +25C, T Package
A
I
O
D
max
RMS Noise, % of V , T = +25C, 10 Hz f 10 kHz
−
N
−
0.003
−
% V
dB
O
A
O
Ripple Rejection, V = 10 V, f = 120 Hz (Note 5)
4
RR
O
Without C
−
66
65
80
−
−
Adj
C
= 10 mF
Adj
Thermal Shutdown (Note 6)
−
−
−
−
180
0.3
−
C
Long−Term Stability, T = T
(Note 7), T = +25C for
3
S
1.0
%/1.0
kHrs.
J
high
A
Endpoint Measurements
Thermal Resistance Junction−to−Case, T Package
1. T to T = 0 to +125C, for LM317T, D2T. T
−
R
−
5.0
−
C/W
q
JC
to T
= −40 to +125C, for LM317BT, BD2T, T
to T
= −55 to +150C, for
low
high
low
high
low
high
NCV317BT, BD2T.
2. I = 1.5 A, P
= 20 W
max
max
3. Load and line regulation are specified at constant junction temperature. Changes in V due to heating effects must be taken into account
O
separately. Pulse testing with low duty cycle is used.
4. Power dissipation within an IC voltage regulator produces a temperature gradient on the die, affecting individual IC components on the die.
These effects can be minimized by proper integrated circuit design and layout techniques. Thermal Regulation is the effect of these
temperature gradients on the output voltage and is expressed in percentage of output change per watt of power change in a specified time.
5. C , when used, is connected between the adjustment pin and ground.
Adj
6. Thermal characteristics are not subject to production test.
7. Since Long−Term Stability cannot be measured on each device before shipment, this specification is an engineering estimate of average
stability from lot to lot.
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