LM317, NCV317
PACKAGE DIMENSIONS
D2PAK−3
D2T SUFFIX
CASE 936−03
ISSUE D
NOTES:
ꢁꢂ1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
ꢁꢂ2. CONTROLLING DIMENSION: INCHES.
ꢁꢂ3. TAB CONTOUR OPTIONAL WITHIN
DIMENSIONS A AND K.
ꢁꢂ4. DIMENSIONS U AND V ESTABLISH A MINIMUM
MOUNTING SURFACE FOR TERMINAL 4.
ꢁꢂ5. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH OR GATE PROTRUSIONS. MOLD
FLASH AND GATE PROTRUSIONS NOT TO
EXCEED 0.025 (0.635) MAXIMUM.
T
T
TERMINAL 4
C
C
A
K
U
OPTIONAL
CHAMFER
OPTIONAL
CHAMFER
ED
ES
S
V
B
DETAIL C
DETAIL C
H
1
2
3
ꢁꢂ6. SINGLE GAUGE DESIGN WILL BE SHIPPED
AFTER FPCN EXPIRATION IN OCTOBER 2011.
J
INCHES
DIM MIN MAX
MILLIMETERS
MIN MAX
9.804 10.236
F
SIDE VIEW
BOTTOM VIEW
SIDE VIEW
A
B
C
D
0.386
0.356
0.170
0.026
0.403
0.368
0.180
0.036
0.055
0.026
SINGLE GAUGE
CONSTRUCTION
DUAL GAUGE
G
9.042
4.318
0.660
1.143
0.457
9.347
4.572
0.914
1.397
0.660
CONSTRUCTION
2X
D
M
0.010 (0.254)
T
TOP VIEW
ED 0.045
ES 0.018
F
G
H
J
0.051 REF
0.100 BSC
0.539 0.579 13.691 14.707
0.125 MAX
0.050 REF
1.295 REF
2.540 BSC
3.175 MAX
1.270 REF
T
N
K
L
M
L
0.000
0.088
0.018
0.058
0.010
0.102
0.026
0.078
0.000
0.254
2.591
0.660
1.981
M
N
P
R
S
U
V
2.235
0.457
1.473
SEATING
PLANE
P
5_REF
5_REF
BOTTOM VIEW
R
0.116 REF
0.200 MIN
0.250 MIN
2.946 REF
5.080 MIN
6.350 MIN
DETAIL C
OPTIONAL CONSTRUCTIONS
SOLDERING FOOTPRINT*
10.49
8.38
16.155
3.25X04
2X
1.016
5.080
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
11
ONSEMI [ ONSEMI ]
