欢迎访问ic37.com |
会员登录 免费注册
发布采购

LM2575T-3.3 参数 Datasheet PDF下载

LM2575T-3.3图片预览
型号: LM2575T-3.3
PDF下载: 下载PDF文件 查看货源
内容描述: 1.0 A,可调输出电压,降压型开关稳压器 [1.0 A, Adjustable Output Voltage, Step-Down Switching Regulator]
分类和应用: 稳压器开关式稳压器或控制器电源电路开关式控制器局域网
文件页数/大小: 27 页 / 266 K
品牌: ONSEMI [ ONSEMI ]
 浏览型号LM2575T-3.3的Datasheet PDF文件第13页浏览型号LM2575T-3.3的Datasheet PDF文件第14页浏览型号LM2575T-3.3的Datasheet PDF文件第15页浏览型号LM2575T-3.3的Datasheet PDF文件第16页浏览型号LM2575T-3.3的Datasheet PDF文件第18页浏览型号LM2575T-3.3的Datasheet PDF文件第19页浏览型号LM2575T-3.3的Datasheet PDF文件第20页浏览型号LM2575T-3.3的Datasheet PDF文件第21页  
LM2575  
GENERAL RECOMMENDATIONS  
Output Voltage Ripple and Transients  
Heatsinking and Thermal Considerations  
Source of the Output Ripple  
The Through−Hole Package TO−220  
Since the LM2575 is a switch mode power supply  
regulator, its output voltage, if left unfiltered, will contain a  
sawtooth ripple voltage at the switching frequency. The  
output ripple voltage value ranges from 0.5% to 3% of the  
output voltage. It is caused mainly by the inductor sawtooth  
ripple current multiplied by the ESR of the output capacitor.  
The LM2575 is available in two packages, a 5−pin  
TO−220(T, TV) and a 5−pin surface mount D PAK(D2T).  
2
There are many applications that require no heatsink to keep  
the LM2575 junction temperature within the allowed  
operating range. The TO−220 package can be used without  
a heatsink for ambient temperatures up to approximately  
50°C (depending on the output voltage and load current).  
Higher ambient temperatures require some heatsinking,  
either to the printed circuit (PC) board or an external  
heatsink.  
Short Voltage Spikes and How to Reduce Them  
The regulator output voltage may also contain short  
voltage spikes at the peaks of the sawtooth waveform (see  
Figure 24). These voltage spikes are present because of the  
fast switching action of the output switch, and the parasitic  
inductance of the output filter capacitor. There are some  
other important factors such as wiring inductance, stray  
capacitance, as well as the scope probe used to evaluate these  
transients, all these contribute to the amplitude of these  
spikes. To minimize these voltage spikes, low inductance  
capacitors should be used, and their lead lengths must be  
kept short. The importance of quality printed circuit board  
layout design should also be highlighted.  
The Surface Mount Package D2PAK and its  
Heatsinking  
The other type of package, the surface mount D PAK, is  
2
designed to be soldered to the copper on the PC board. The  
copper and the board are the heatsink for this package and  
the other heat producing components, such as the catch  
diode and inductor. The PC board copper area that the  
2
2
package is soldered to should be at least 0.4 in (or 100 mm )  
2
and ideally should have 2 or more square inches (1300 mm )  
of 0.0028 inch copper. Additional increasing of copper area  
2
2
Voltage spikes caused by switching action of the output  
switch and the parasitic inductance of the output capacitor  
beyond approximately 3.0 in (2000 mm ) will not improve  
heat dissipation significantly. If further thermal  
improvements are needed, double sided or multilayer PC  
boards with large copper areas should be considered.  
UNFILTERED  
OUTPUT  
VOLTAGE  
Thermal Analysis and Design  
The following procedure must be performed to determine  
whether or not a heatsink will be required. First determine:  
VERTICAL  
RESOLUTION:  
20 mV/DIV  
1. P  
2. T  
3. T  
maximum regulator power dissipation in  
the application.  
maximum ambient temperature in the  
application.  
maximum allowed junction temperature  
(125°C for the LM2575). For a conservative  
design, the maximum junction temperature  
should not exceed 110°C to assure safe  
operation. For every additional 10°C  
temperature rise that the junction must  
withstand, the estimated operating lifetime  
of the component is halved.  
D(max)  
FILTERED  
OUTPUT  
VOLTAGE  
)
A(max  
J(max)  
HORIZONTAL TIME BASE: 10 ms/DIV  
Figure 24. Output Ripple Voltage Waveforms  
Minimizing the Output Ripple  
In order to minimize the output ripple voltage it is possible  
to enlarge the inductance value of the inductor L1 and/or to  
use a larger value output capacitor. There is also another way  
to smooth the output by means of an additional LC filter  
(20 mH, 100 mF), that can be added to the output (see  
Figure 33) to further reduce the amount of output ripple and  
transients. With such a filter it is possible to reduce the  
output ripple voltage transients 10 times or more. Figure 24  
shows the difference between filtered and unfiltered output  
waveforms of the regulator shown in Figure 33.  
4. R  
5. R  
package thermal resistance junction−case.  
package thermal resistance junction−ambient.  
qJC  
qJA  
(Refer to Absolute Maximum Ratings in this data sheet or  
and R values).  
R
qJC  
qJA  
The following formula is to calculate the total power  
dissipated by the LM2575:  
PD = (Vin x IQ) + d x ILoad x Vsat  
The upper waveform is from the normal unfiltered output  
of the converter, while the lower waveform shows the output  
ripple voltage filtered by an additional LC filter.  
where d is the duty cycle and for buck converter  
http://onsemi.com  
17