ESD5Z2.5T1G Series,
SZESD5Z2.5T1G Series
Transient Voltage
Suppressors
Micro−Packaged Diodes for ESD Protection
The ESD5Z Series is designed to protect voltage sensitive components
from ESD and transient voltage events. Excellent clamping capability,
low leakage, and fast response time, make these parts ideal for ESD
protection on designs where board space is at a premium. Because of its
small size, it is suited for use in cellular phones, portable devices, digital
cameras, power supplies and many other portable applications.
Specification Features:
http://onsemi.com
SOD−523
CASE 502
PLASTIC
STYLE 1
Low Clamping Voltage
Small Body Outline Dimensions:
0.047 x 0.032 (1.20 mm x 0.80 mm)
Low Body Height: 0.028 (0.7 mm)
Stand−off Voltage: 2.5 V
−
12 V
Peak Power up to 240 Watts @ 8 x 20
ms
Pulse
Low Leakage
Response Time is Typically < 1 ns
ESD Rating of Class 3 (> 16 kV) per Human Body Model
IEC61000−4−2 Level 4 ESD Protection
IEC61000−4−4 Level 4 EFT Protection
SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
Pb−Free Packages are Available*
1
Cathode
2
Anode
MARKING DIAGRAM
XX
1
G
M
G
2
Shipping
†
3,000 /
Tape & Reel
3,000 /
Tape & Reel
XX = Specific Device Code
M = Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation may vary
depending upon manufacturing location.
Mechanical Characteristics:
CASE:
Void-free, transfer-molded, thermosetting plastic
ORDERING INFORMATION
Device
ESD5ZxxxT1G
SZESD5ZxxxT1G
Package
SOD−523
Pb−Free
SOD−523
Pb−Free
Epoxy Meets UL 94 V−0
LEAD FINISH:
100% Matte Sn (Tin)
MOUNTING POSITION:
Any
QUALIFIED MAX REFLOW TEMPERATURE:
260C
Device Meets MSL 1 Requirements
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics tables starting on
page 3 of this data sheet.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
Semiconductor Components Industries, LLC, 2012
February, 2012
−
Rev. 10
1
Publication Order Number:
ESD5Z2.5T1/D
ONSEMI [ ON SEMICONDUCTOR ]
