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BSS138LT1G 参数 Datasheet PDF下载

BSS138LT1G图片预览
型号: BSS138LT1G
PDF下载: 下载PDF文件 查看货源
内容描述: 功率MOSFET 200毫安, 50 V的N沟道SOT- 23 [Power MOSFET 200 mA, 50 V N−Channel SOT−23]
分类和应用: 晶体小信号场效应晶体管开关光电二极管PC
文件页数/大小: 5 页 / 64 K
品牌: ONSEMI [ ON SEMICONDUCTOR ]
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BSS138LT1
Preferred Device
Power MOSFET
200 mA, 50 V
N−Channel SOT−23
Typical applications are DC−DC converters, power management in
portable and battery−powered products such as computers, printers,
PCMCIA cards, cellular and cordless telephones.
Features
http://onsemi.com
Low Threshold Voltage (V
GS(th)
: 0.5 V−1.5 V) Makes it Ideal for
Low Voltage Applications
Miniature SOT−23 Surface Mount Package Saves Board Space
Pb−Free Packages are Available
1
200 mA, 50 V
R
DS(on)
= 3.5
W
N−Channel
3
MAXIMUM RATINGS
(T
A
= 25°C unless otherwise noted)
Rating
Drain−to−Source Voltage
Gate−to−Source Voltage − Continuous
Drain Current
− Continuous @ T
A
= 25°C
− Pulsed Drain Current (t
p
10
ms)
Total Power Dissipation @ T
A
= 25°C
Operating and Storage Temperature
Range
Thermal Resistance,
Junction−to−Ambient
Maximum Lead Temperature for
Soldering Purposes, for 10 seconds
Symbol
V
DSS
V
GS
I
D
I
DM
P
D
T
J
, T
stg
R
qJA
T
L
Value
50
±
20
200
800
225
− 55 to 150
556
260
mW
°C
°C/W
°C
Unit
Vdc
Vdc
mA
1
2
3
2
MARKING
DIAGRAM
SOT−23
CASE 318
STYLE 21
J1 M
G
G
1
J1
= Device Code
M
= Date Code*
G
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or overbar may
vary depending upon manufacturing location.
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
ORDERING INFORMATION
Device
BSS138LT1
BSS138LT1G
BSS138LT3
BSS138LT3G
Package
SOT−23
SOT−23
(Pb−Free)
SOT−23
SOT−23
(Pb−Free)
Shipping
3000 Tape & Reel
3000 Tape & Reel
10,000 Tape & Reel
10,000 Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Preferred
devices are recommended choices for future use
and best overall value.
©
Semiconductor Components Industries, LLC, 2005
1
October, 2005 − Rev. 4
Publication Order Number:
BSS138LT1/D