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BD136 参数 Datasheet PDF下载

BD136图片预览
型号: BD136
PDF下载: 下载PDF文件 查看货源
内容描述: 塑料中功率硅PNP晶体管 [Plastic Medium Power Silicon PNP Transistor]
分类和应用: 晶体晶体管
文件页数/大小: 4 页 / 42 K
品牌: ONSEMI [ ON SEMICONDUCTOR ]
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BD136, BD138, BD140
Plastic Medium Power
Silicon PNP Transistor
This series of plastic, medium−power silicon PNP transistors are
designed for use as audio amplifiers and drivers utilizing
complementary or quasi complementary circuits.
http://onsemi.com
Features
Pb−Free Packages are Available
*
DC Current Gain − h
FE
= 40 (Min) @ I
C
= 0.15 Adc
BD 136, 138, 140 are complementary with BD 135, 137, 139
1.5 A POWER TRANSISTORS
PNP SILICON
45, 60, 80 V, 12.5 W
MAXIMUM RATINGS
Rating
Collector−Emitter Voltage
BD136
BD138
BD140
BD136
BD138
BD140
Symbol
V
CEO
Value
45
60
80
45
60
100
5.0
1.5
0.5
1.25
10
12.5
100
– 55 to
+ 150
Unit
Vdc
3 2
1
Vdc
TO−225AA
CASE 77
STYLE 1
Collector−Base Voltage
V
CBO
MARKING DIAGRAM
Vdc
Adc
Adc
Watts
mW/°C
Watts
mW/°C
°C
BD136
BD136G
BD138
BD138G
Device
xx
Y
WW
= 36, 38, 40
= Year
= Work Week
YWW
BD1xx
Emitter−Base Voltage
Collector Current
Base Current
Total Device Dissipation @ T
A
= 25°C
Derate above 25°C
Total Device Dissipation @ T
C
= 25°C
Derate above 25°C
Operating and Storage Junction
Temperature Range
V
EBO
I
C
I
B
P
D
P
D
T
J
, T
stg
ORDERING INFORMATION
Package
TO−225AA
TO−225AA
(Pb−Free)
TO−225AA
TO−225AA
(Pb−Free)
TO−225AA
TO−225AA
(Pb−Free)
Shipping
500 Units/Box
500 Units/Box
500 Units/Box
500 Units/Box
500 Units/Box
500 Units/Box
Maximum ratings are those values beyond which device damage can oc-
cur. Maximum ratings applied to the device are individual stress limit values
(not normal operating conditions) and are not valid simultaneously. If these
limits are exceeded, device functional operation is not implied, damage
may occur and reliability may be affected.
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance,
Junction−to−Case
Thermal Resistance,
Junction−to−Ambient
Symbol
q
JC
q
JA
Max
10
100
Unit
°C/W
°C/W
BD140
BD140G
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
©
Semiconductor Components Industries, LLC, 2005
1
April, 2005 − Rev. 12
Publication Order Number:
BD136/D