BAW56LT1G
Dual Switching Diode
Common Anode
Features
•
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
MAXIMUM RATINGS
(EACH DIODE)
Rating
Reverse Voltage
Forward Current
Peak Forward Surge Current
Non−Repetitive Peak Forward Current
t = 1
ms
(Note 3)
Symbol
V
R
I
F
I
FM(surge)
I
FSM
Value
70
200
500
4
Unit
V
mA
mA
A
ANODE
3
http://onsemi.com
CATHODE
1
2
CATHODE
3
1
THERMAL CHARACTERISTICS
Characteristic
Total Device Dissipation FR− 5 Board
(Note 1)
T
A
= 25°C
Derate above 25°C
Thermal Resistance,
Junction−to−Ambient
Total Device Dissipation
Alumina Substrate,
(Note 2) T
A
= 25°C
Derate above 25°C
Thermal Resistance,
Junction−to−Ambient
Junction and Storage Temperature
Symbol
P
D
Max
225
1.8
R
qJA
P
D
556
300
2.4
R
qJA
T
J
, T
stg
417
−55
to
+150
Unit
mW
mW/°C
°C/W
mW
mW/°C
°C/W
°C
A1
M
G
2
SOT−23 (TO−236)
CASE 318
STYLE 12
MARKING DIAGRAM
A1 M
G
G
1
= Device Code
= Date Code*
= Pb−Free Package
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR−5 = 1.0
0.75
0.062 in.
2. Alumina = 0.4
0.3
0.024 in. 99.5% alumina.
3. Square Wave; T
j
= 25°C.
(Note: Microdot may be in either location)
*Date Code orientation and/or overbar may
vary depending upon manufacturing location.
ORDERING INFORMATION
Device
BAW56LT1G
BAW56LT3G
Package
SOT−23
(Pb−Free)
SOT−23
(Pb−Free)
Shipping
†
3000 / Tape & Reel
10,000 / Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
©
Semiconductor Components Industries, LLC, 2009
August, 2009
−
Rev. 6
1
Publication Order Number:
BAW56LT1/D
ONSEMI [ ON SEMICONDUCTOR ]
