ADM1024
V
CC
VID0/IRQ0
VID1/IRQ1
VID2/IRQ2
VID3/IRQ3
VID4/IRQ4
ADM1024
VID0–3 AND
FAN DIVISOR
REGISTER
NTEST_OUT/ADD
SERIAL BUS
INTERFACE
SDA
SCL
100k
W
PULLUPS
VID4 AND
DEVICE ID
REGISTER
FAN SPEED
COUNTER
ADDRESS
POINTER
REGISTER
CHANNEL
MODE
REGISTER
VALUE AND
LIMIT
REGISTERS
LIMIT
COMPARATORS
INTERRUPT
STATUS
REGISTERS
INT MASK
REGISTERS
INTERRUPT
MASKING
CONFIGURATION
REGISTERS
CI
FAN1/AIN1
FAN2/AIN2
+V
CCP1
+2.5V
IN
/D2+
+5.0V
IN
+12V
IN
V
CCP2
/D2–
D1+
D1–
V
CC
BAND GAP
TEMPERATURE
SENSOR
POWER TO CHIP
INPUT
ATTENUATORS
AND
ANALOG
MULTIPLEXER
TEMPERATURE
CONFIGURATION
REGISTER
V
CC
100k
W
V
CC
100k
W
THERM
INT
10−BIT ADC
2.5V
BAND GAP
REFERENCE
ANALOG
OUTPUT
REGISTER AND
8−BIT DAC
CHASSIS
INTRUSION
CLEAR
REGISTER
V
CC
100k
W
NTEST_IN/AOUT
RESET
GND
Figure 1. Functional Block Diagram
ABSOLUTE MAXIMUM RATINGS
Parameter
Positive Supply Voltage (V
CC
)
Voltage on 12 V
IN
Pin
Voltage on AOUT, NTEST_OUT ADD, 2.5 V
IN
/D2+
Voltage on Any Other Input or Output Pin
Input Current at Any Pin
Package Input Current
Maximum Junction Temperature (T
JMAX
)
Storage Temperature Range
Lead Temperature, Soldering
Vapor Phase (60 sec)
Infrared (15 sec)
ESD Rating All Pins
Rating
6.5
20
−0.3
to (V
CC
+0.3)
−0.3
to +6.5
±5
±20
150
−65
to +150
215
200
2000
Unit
V
V
V
V
mA
mA
°C
°C
°C
V
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
NOTE: This device is ESD sensitive. Use standard ESD precautions when handling.
THERMAL CHARACTERISTICS
Package Type
24−Lead Small Outline Package
q
JA
50
q
JC
10
Unit
°C/W
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