MC74AC244, MC74ACT244
PACKAGE DIMENSIONS
PDIP–20
N SUFFIX
20 PIN PLASTIC DIP PACKAGE
CASE 738–03
ISSUE E
–A–
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
20
1
11
10
B
4. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
L
C
INCHES
DIM MIN MAX
MILLIMETERS
MIN
25.66
6.10
3.81
0.39
MAX
27.17
6.60
4.57
0.55
A
B
C
D
E
F
1.010
0.240
0.150
0.015
1.070
0.260
0.180
0.022
–T–
SEATING
PLANE
K
0.050 BSC
1.27 BSC
M
0.050
0.070
1.27
1.77
N
E
G
J
0.100 BSC
2.54 BSC
0.008
0.110
0.015
0.140
0.21
2.80
0.38
3.55
G
F
K
L
J 20 PL
0.300 BSC
7.62 BSC
D 20 PL
M
M
T B
0.25 (0.010)
M
N
0
0.020
15
_
0.040
0
_
0.51
15
_
1.01
_
M
M
0.25 (0.010)
T
A
SO–20
DW SUFFIX
20 PIN PLASTIC SOIC PACKAGE
CASE 751D–05
ISSUE F
D
A
q
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
20
11
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
PROTRUSION.
E
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF B
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
1
10
MILLIMETERS
DIM MIN
MAX
2.65
0.25
0.49
0.32
12.95
7.60
B
A
A1
B
C
D
E
2.35
0.10
0.35
0.23
12.65
7.40
20X B
M
S
S
B
T
0.25
A
e
1.27 BSC
A
H
h
10.05
0.25
0.50
0
10.55
0.75
0.90
7
L
SEATING
PLANE
q
_
_
18X e
A1
C
T
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