1.5SMC6.8AT3 Series
PACKAGE DIMENSIONS
SMC
CASE 403−03
ISSUE B
S
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. D DIMENSION SHALL BE MEASURED WITHIN
DIMENSION P.
INCHES
DIM MIN
MAX
A
0.260
0.280
B
0.220
0.240
C
0.075
0.095
D
0.115
0.121
H
0.0020 0.0060
J
0.006
0.012
K
0.030
0.050
P
0.020 REF
S
0.305
0.320
MILLIMETERS
MIN
MAX
6.60
7.11
5.59
6.10
1.90
2.41
2.92
3.07
0.051
0.152
0.15
0.30
0.76
1.27
0.51 REF
7.75
8.13
D
B
C
J
H
K
P
SOLDERING FOOTPRINT*
4.343
0.171
3.810
0.150
2.794
0.110
SCALE 4:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
7
ONSEMI [ ON SEMICONDUCTOR ]
