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0W888-002-XTP 参数 Datasheet PDF下载

0W888-002-XTP图片预览
型号: 0W888-002-XTP
PDF下载: 下载PDF文件 查看货源
内容描述: 高性能的可编程音频处理系统 [High-Performance Programmable Audio Processing System]
分类和应用:
文件页数/大小: 6 页 / 119 K
品牌: ONSEMI [ ON SEMICONDUCTOR ]
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SMF5.0AT1G Series,
SZSMF5.0AT1G Series
200 W Transient
Voltage Suppressor
SOD-123 Flat Lead Package
The SMF5.0AT1G Series is designed to protect voltage sensitive
components from high voltage, high energy transients. Excellent
clamping capability, high surge capability, low zener impedance and
fast response time. Because of its small size, it is ideal for use in
cellular phones, portable devices, business machines, power supplies
and many other industrial/consumer applications.
Features
http://onsemi.com
PLASTIC SURFACE MOUNT
ZENER OVERVOLTAGE
TRANSIENT SUPPRESSOR
5
58 VOLTS
200 WATT PEAK POWER
Stand−off Voltage: 5
58 Volts
Peak Power
200 Watts @ 1 ms (SMF5.0A
SMF58A)
Low Leakage
Response Time is Typically < 1 ns
ESD Rating of Class 3 (> 16 kV) per Human Body Model
ESD Rating of Level 4 (8 kV Contact Discharge) per IEC61000−4−2
EFT (Electrical Fast Transients) Rating of 40 A per IEC61000−4−4
Low Profile
Maximum Height of 1.0 mm
Small Footprint
Footprint Area of 8.45 mm
2
Supplied in 8 mm Tape and Reel
3,000 Units per Reel
Cathode Indicated by Polarity Band
Lead Orientation in Tape: Cathode Lead to Sprocket Holes
SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
These Devices are Pb−Free and are RoHS Compliant*
Mechanical Characteristics:
CASE:
Void-free, transfer-molded, thermosetting plastic
SOD−123FL
CASE 498
1
1: CATHODE
2: ANODE
2
MARKING DIAGRAM
1
CATHODE
xx
M
G
xx M
G
G
2
ANODE
Epoxy Meets UL 94 V−0
LEAD FINISH:
100% Matte Sn (Tin)
MOUNTING POSITION:
Any
QUALIFIED MAX REFLOW TEMPERATURE:
260°C
= Device Code (Refer to page 3)
= Date Code
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
SMFxxxAT1G
SZSMFxxxAT1G
Package
SOD−123FL
(Pb−Free)
SOD−123FL
(Pb−Free)
Shipping
3,000 /
Tape & Reel
3,000 /
Tape & Reel
Device Meets MSL 1 Requirements
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
DEVICE MARKING INFORMATION
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
©
Semiconductor Components Industries, LLC, 2013
See specific marking information in the device marking
column of the Electrical Characteristics table on page 3 of
this data sheet.
May, 2013
Rev. 7
1
Publication Order Number:
SMF5.0AT1/D