BelaSigna 200
13.0 Re-flow Information
The re-flow profile depends on the equipment that is used for the reflow and the assembly that is being reflowed. Use the following
table from the JEDEC Standard 22-A113D Para 3.1.6 for Sn-Pb Eutectic Assembly as a guideline:
Table 17: Re-flow Information
Profile Feature
Sn-Pb Eutectic Assembly
Pb-free Assembly
Average Ramp-Up Rate (TL to TP)
Preheat
3°C/second maximum
3°C/second maximum
Temperature minimum (TSMIN)
Temperature maximum (TSMAX)
Time (min. to max.) (ts)
TSMAX to TL
100°C
150°C
150°C
200°C
60-120 seconds
60-180 seconds
Ramp-up rate
3°C/second maximum
Time Maintained Above
Temperature (TL)
183°C
217°C
Time (tL)
60-150 seconds
240 +0/-5°C
60-150 seconds
260 +0/-5°C
Peak Temperature (TP)
Time within 5°C of Actual Peak Temperature
Ramp-Down Rate
10-30 seconds
6°C/second maximum
6 minutes maximum
10-30 seconds
6°C/second maximum
8 minutes maximum
Time 25°C to Peak Temperature
All BelaSigna 200 QFNs with part number revisions 003 (i.e. 0W344-003-XTP) and higher are Pb-free and should follow the re-flow
guidelines for Pb-free assemblies. All BelaSigna 200 CSPs are Pb-free.
14.0 ESD Sensitive Device
CAUTION: Electrostatic discharge (ESD) sensitive device. Permanent damage may occur on devices subjected
to high-energy electrostatic discharges. Proper ESD precautions in handling, packaging and testing are
recommended to avoid performance degradation or loss of functionality.
15.0 Training
To facilitate development on the BelaSigna 200 platform, training is available upon request. Contact your account manager for more
information.
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