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0IMD9-001-XTP 参数 Datasheet PDF下载

0IMD9-001-XTP图片预览
型号: 0IMD9-001-XTP
PDF下载: 下载PDF文件 查看货源
内容描述: [SIGNAL DIODE]
分类和应用: 光电二极管
文件页数/大小: 4 页 / 96 K
品牌: ONSEMI [ ON SEMICONDUCTOR ]
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0IMD9-001
Product Preview
Schottky Barrier Diodes
These Schottky barrier diodes are designed for high speed switching
applications, circuit protection, and voltage clamping. Extremely low
forward voltage reduces conduction loss. Miniature surface mount
package is ideal for medical applications where space is limited.
Features
Extremely Fast Switching Speed
Low Forward Voltage
0.35 V (Typ) @ I
F
= 10 mAdc
Device Marking: MAM
AEC Qualified and Built In Medical Flow
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
30 VOLT SILICON
HOT−CARRIER DETECTOR
AND SWITCHING DIODES
MAXIMUM RATINGS
(T
J
= 125°C unless otherwise noted)
Rating
Reverse Voltage
Symbol
V
R
Value
30
Unit
V
SOD−323
CASE 477
STYLE 1
1
CATHODE
2
ANODE
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
MARKING DIAGRAM
MAM
G
G
THERMAL CHARACTERISTICS
Characteristic
Total Device Dissipation FR−5 Board,
(Note 1)
T
A
= 25°C
Derate above 25°C
Forward Current (DC)
Non−Repetitive Peak Forward Current,
t
p
< 10 msec
Repetitive Peak Forward Current
Pulse Wave = 1 sec, Duty Cycle = 66%
Thermal Resistance
Junction−to−Ambient
Junction and Storage Temperature Range
1. FR−4 Minimum Pad
This document contains information on a product under development. ON Semiconductor
reserves the right to change or discontinue this product without notice.
Symbol
P
D
Max
Unit
1
2
200
1.57
I
F
I
FSM
I
FRM
R
qJA
T
J
, T
stg
200
Max
600
300
635
−55
to150
mW
mW/°C
mA
mA
MA
M
G
= Device Code
= Date Code
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
mA
°C/W
°C
Device
0IMD9−001−XTP
Package
SOD−323
(Pb−Free)
Shipping
3000 /
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
©
Semiconductor Components Industries, LLC, 2014
October, 2014
Rev. P0
1
Publication Order Number:
0IMD9−001/D