Recommended Soldering Method
T4
T3
•
The thickness of the solder paste is to be applied between 150 and
200
μm
and the land pattern should be based on OMRON's recom-
mended PCB pattern.
•
To maintain the correct soldering joint shown in the following dia-
gram, we recommend applying solder with the soldering conditions
shown on the left.
•
Check the soldering in the actual mounting conditions before use.
•
When washing the product after soldering the RF MEMS Switch to
a print circuit board, use a water-based solvent or alcohol-based
solvent and keep the solvent temperature to less than 40°C.
•
Do not put the RF MEMS Switch in a cold cleaning bath immedi-
ately after soldering.
Temperature (°C)
T2
T1
t
1
Preheating
t
2
Soldering
Time (s)
Measuring position/Item
Terminal
Upper surface of case
Preheating (T1 to T2, t
1
)
150°C to 180°C
120 s max.
---
Soldering (T3, t
2
)
230°C min.
30 s max.
---
Peak value (T4)
250°C max.
255°C max.
Example of Drive Circuit for RF MEMS Switch
+Vcc
INPUT 1
Vcont_1
RF_1
Gate Driver
R
RF_com
R
RF_2
DRIVER IC
Vcont_2
2SMES-01
INPUT 2
Note: 1.
Operate the driving voltage with the high-side switch (Vcont_1 & Vcont_2, not ground).
2.
It is necessary to discharge the charge that accumulates in the electrostatic actuator to turn off the RF MEMS Switch because this product
is a MEMS Switch of an electrostatic drive type. Install the electrical discharge circuit in the drive circuit of the RF MEMS Switch with a
resistance of 1 MΩ or less. Without an electrical discharge circuit, the RF MEMS Switch might not turn off, and the contacts could stick.
For Reference Only
High frequency characteristics - method and substrate for measurement
Agilent N5230
Vector Network
Analyzer
2SMES-01
Note:
Substrate: t = 1.6 mm Rogers 4350B (Dielectric constant at 10 GHz: 3.48)
RF MEMS Switch
2SMES-01
95
OMRON [ OMRON ELECTRONICS LLC ]
