PEDL9040A-03
¡ Semiconductor
ML9040A-Axx/-Bxx
PAD CONFIGURATION
Pad Layout
Chip size: 2.94 x 4.32 mm
Passivation film etched hole: 80 x 80 mm
Y
57
43
58
42
X
18
81
17
1
Pad Coordinates
Pad
1
Pad Name
SEG39
SEG38
SEG37
SEG36
SEG35
SEG34
SEG33
SEG32
SEG31
SEG30
SEG29
SEG28
SEG27
SEG26
SEG25
SEG24
SEG23
SEG22
SEG21
SEG20
X(µm)
–1310
–1156
–1002
–848
–694
–540
–386
–233
–79
Y (µm)
–1955
–1955
–1955
–1955
–1955
–1955
–1955
–1955
–1955
–1955
–1955
–1955
–1955
–1955
–1955
–1955
–1955
–1955
–1615
–1478
Pad
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
Pad Name
SEG19
SEG18
SEG17
SEG16
SEG15
SEG14
SEG13
SEG12
SEG11
SEG10
SEG9
X(µm)
1311
1311
1311
1311
1311
1311
1311
1311
1311
1311
1311
1311
1311
1311
1311
1311
1311
1311
1311
1311
Y (µm)
–1342
–1206
–1070
–934
–797
–661
–525
–389
–253
–116
20
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
75
229
383
SEG8
156
537
SEG7
292
691
SEG6
428
845
SEG5
565
999
SEG4
701
1153
1309
1311
1311
SEG3
837
SEG2
973
SEG1
1109
1296
TEST
46/49
OKI [ OKI ELECTRONIC COMPONETS ]
