PEDL9040A-03
¡ Semiconductor
ML9040A-Axx/-Bxx
PACKAGE DIMENSIONS
(Unit : mm)
QFP80-P-1420-0.80-BK
Mirror finish
Package material
Lead frame material
Pin treatment
Package weight (g)
Rev. No./Last Revised
Epoxy resin
42 alloy
Solder plating (≥5 mm)
1.27 TYP.
4/Nov. 28, 1996
Oki Electric Industry Co., Ltd.
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SHP, and BGA are surface mount type
packages, which are very susceptible to heat in reflow mounting and humidity absorbed in
storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person
ontheproductname,packagename,pinnumber,packagecodeanddesiredmountingconditions
(reflow method, temperature and times).
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OKI [ OKI ELECTRONIC COMPONETS ]
