¡ Semiconductor
ML7000-01/02/03/ML7001-01/02/03
NOTES ON USE
• Toensureproperelectricalcharacteristics,usebypasscapacitorswithexcellenthighfrequency
characteristics for the power supply and keep them as close as possible to the device pins.
• Connect the AG pin and the DG pin as closely as possible. Connect to the system ground with
low impedance.
• Mount the device directly on the board when mounted on PCBs. Do not use IC sockets. If the
use of IC socket is unavoidable, use the short lead type socket.
• When mounted on a frame, use electromagnetic shielding if any electromagnetic wave
sources such as power supply transformers surrounds the device.
• Keep the voltage on the V pin not lower than –0.3 V even instantaneously to avoid latch-
DD
up that may otherwise occur when power is turned on.
• Use a low noise (particularly, low level type of high frequency spike noise or pulse noise)
powersupplytoavoiderroneousoperationandthedegradationofthecharacteristicsofthese
devices.
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OKI [ OKI ELECTRONIC COMPONETS ]
