FEDL66525-02
OKI Semiconductor
ML66525 Family
PACKAGE DIMENSIONS
(Unit: mm)
P-LFBGA144-1111-0.80
Package material
Ball material
Epoxy resin
Sn/Pb
Package weight (g)
Rev. No./Last Revised
0.30 TYP.
1/Aug. 25, 1999
5
Notes for Mounting the Surface Mount Type Packages
The surface mount type packages are very susceptible to heat in reflow mounting and humidity
absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person on the product
name, package name, pin number, package code and desired mounting conditions (reflow method,
temperature and times).
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OKI [ OKI ELECTRONIC COMPONETS ]
