¡ Semiconductor
ML63512A/63514A
PACKAGE DIMENSIONS
(Unit : mm)
TQFP48-P-0707-0.50-K
Mirror finish
Package material
Epoxy resin
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
42 alloy
Solder plating
5 mm or more
0.13 TYP.
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SHP, and BGA are surface mount type
packages, which are very susceptible to heat in reflow mounting and humidity absorbed in
storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person
ontheproductname,packagename,pinnumber,packagecodeanddesiredmountingconditions
(reflow method, temperature and times).
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