¡ Semiconductor
ML63187/63189B
DC Characteristics (continued)
• When backup is used
(VDD = VDDI = 1.5 V, VSS = 0 V, 1/5 bias, Ta = –20 to +70°C unless otherwise specified)
Mea-
Parameter Symbol
Condition
CPU is in HALT state.
(High-speed clock oscillation
stopped)
Min. Typ. Max. Unit
suring
Circuit
Ta = –20 to +50°C
Ta = –20 to +70°C
—
—
5
5
6.5
10
Supply Current 1 IDD1
mA
mA
CPU is in HALT state.
LCD is in Power Down mode.
(High-speed clock oscillation
stopped)
Ta = –20 to +50°C
Ta = –20 to +70°C
Ta = –20 to +50°C
Ta = –20 to +70°C
—
—
—
4
4
5
8
Supply Current 2 IDD2
Supply Current 3 IDD3
CPU is in operation at
low-speed oscillation.
(High-speed clock oscillation
stopped)
16
18
mA
mA
1
—
—
16
20
CPU is in operation at high-speed oscillation
Supply Current 4 IDD4
Supply Current 5 IDD5
800 1000 mA
700 850 mA
(RC oscillation, ROSH = 100 kW)
CPU is in operation at high-speed oscillation
(Ceramic oscillation, 1 MHz)
—
• When backup is not used
(VDD = VDDI = 3.0 V, VSS = 0 V, 1/5 bias, Ta = –20 to +70°C unless otherwise specified)
Mea-
Parameter Symbol
Condition
CPU is in HALT state.
(High-speed clock oscillation
stopped)
Min. Typ. Max. Unit
suring
Circuit
Ta = –20 to +50°C
Ta = –20 to +70°C
—
—
2.2
2.2
3
5
Supply Current 1 IDD1
mA
mA
CPU is in HALT state.
LCD is in Power Down mode.
(High-speed clock oscillation
stopped)
Ta = –20 to +50°C
Ta = –20 to +70°C
Ta = –20 to +50°C
Ta = –20 to +70°C
—
—
—
—
1.8
1.8
7.5
7.5
2.5
4
Supply Current 2 IDD2
Supply Current 3 IDD3
CPU is in operation at
low-speed oscillation.
(High-speed clock oscillation
stopped)
9
1
mA
mA
12
CPU is in operation at high-speed oscillation
Supply Current 4 IDD4
Supply Current 5 IDD5
—
—
550
700
(RC oscillation, ROSH = 100 kW)
CPU is in operation at high-speed oscillation
(Ceramic oscillation, 2 MHz)
850 1000 mA
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