FEDL2302DIGEST-05
OKI Semiconductor
ML2302
(Unit: mm)
P-VFLGA71-6.2x6.5-0.65-W
Package material
Ball material
Epoxy resin
Sn/Pb
Package weight (g)
Rev. No./Last Revised
0.03 TYP.
2/Oct. 31, 2000
5
Notes for Mounting the Surface Mount Type Package
The surface mount type packages are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name,
package name, pin number, package code and desired mounting conditions (reflow method, temperature and
times).
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