FEDL2280XDIGEST-03
OKI Semiconductor
ML22808/ML22804/ML22802-XXX
PACKAGE DIMENSIONS
(Unit: mm)
SSOP30-P-56-0.65-K
Mirror finish
Package material
Lead frame material
Pin treatment
Package weight (g)
Rev. No./Last Revised
Epoxy resin
42 alloy
Solder plating (≥5µm)
0.19 TYP.
5/Dec. 5, 1996
5
Notes for Mounting the Surface Mount Type Package
The surface mount type packages are very susceptible to heat in reflow mounting and humidity absorbed in
storage. Therefore, before you perform reflow mounting, contact OKI’s responsible sales person for the product
name, package name, pin number, package code and desired mounting conditions (reflow method, temperature
and times).
16/18
OKI [ OKI ELECTRONIC COMPONETS ]
