ODHKGL4126FA-03
KGL4126FA
1
Electronic Components
Assembly and ESD Considerations
Mounting Process:
ꢀ The heat sink on the backside of IC package is recommended to have a good thermal path to the
electrically grounding metal on the PC board using a conductive adhesive, such as silver paste. If
conductive adhesive is not used, a thin thermal and electrically conductive film is recommended to
between the IC and PC board.
Soldering Process:
ꢀ Soldering such that the heating area is spatially confined only in the vicinity of IC leads is
recommended.
ꢀ The soldering condition is either shorter than 10 seconds at the lead temperature of lower than 260
degC, or shorter than 3 seconds at the temperature of lower than 310 degC.
ꢀ During soldering, pre-heating of PC board is required. The recommended temperature is in the
range between 120 degC and 150 degC. If the temperature is lower than that, "solder balls" may
occur.
ꢀ A soldering iron with electrical isolation higher than 10M ohm as well as a small leakage voltage is
recommended.
ESD Considerations:
ꢀ This device can be damaged by ESD; therefore appropriate precautions must be taken to avoid
exposure to ESD and EOS during handling, assembly, and testing of these devices. Failure to
adhere to proper ESD/EOS precautions during handling and assembly of these devices can damage
or adversely affect device reliability.
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OKI [ OKI ELECTRONIC COMPONETS ]
