TDA6650TT; TDA6651TT
NXP Semiconductors
5 V mixer/oscillator and low noise PLL synthesizer
Table 20. Limiting values…continued
In accordance with the Absolute Maximum Rating System (IEC 60134). Positive currents are
entering the IC and negative currents are going out of the IC; all voltages are referenced to ground
[1]
.
Symbol
Parameter
Conditions
Min
Max
Unit
Vn
voltage on all other inputs,
outputs and combined
inputs and outputs, except
grounds
4.5 V < VCC < 5.5 V
−0.3
VCC + 0.3
V
IBSn
PMOS port output current
corresponding port
on; open-drain
−20
−50
-
0
mA
mA
s
IBS(tot)
tsc(max)
sum of all PMOS port output open-drain
currents
0
maximum short-circuit time each pin to VCC or
to ground
10
Tstg
Tamb
Tj
storage temperature
ambient temperature
junction temperature
−40
−20
-
+150
°C
°C
°C
[2]
Tamb(max)
150
[1] Maximum ratings cannot be exceeded, not even momentarily without causing irreversible IC damage.
Maximum ratings cannot be accumulated.
[2] The maximum allowed ambient temperature Tamb(max) depends on the assembly conditions of the package
and especially on the design of the printed-circuit board. The application mounting must be done in such a
way that the maximum junction temperature is never exceeded. An estimation of the junction temperature
can be obtained through measurement of the temperature of the top center of the package (Tpackage). The
temperature difference junction to case (∆Tj-c) is estimated at about 13 °C on the demo board (PCB 827-3).
The junction temperature: Tj = Tpackage + ∆Tj-c
.
11. Thermal characteristics
Table 21. Thermal characteristics
Symbol
Parameter
Conditions
Typ
Unit
[1][2][3]
Rth(j-a)
thermal resistance from in free air
junction to ambient
TDA6650TT
TDA6651TT
82
74
K/W
K/W
[1] Measured in free air as defined by JEDEC standard JESD51-2.
[2] These values are given for information only. The thermal resistance depends strongly on the nature and
design of the printed-circuit board used in the application.The thermal resistance given corresponds to the
value that can be measured on a multilayer printed-circuit board (4 layers) as defined by JEDEC standard.
[3] The junction temperature influences strongly the reliability of an IC. The printed-circuit board used in the
application contributes in a large part to the overall thermal characteristic. It must therefore be insured that
the junction temperature of the IC never exceeds Tj(max) = 150 °C at the maximum ambient temperature.
TDA6650TT_6651TT_5
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 05 — 10 January 2007
20 of 54
NXP [ NXP ]
