NXP Semiconductors
PCF8563
Real-time clock/calendar
temperature
maximum peak temperature
= MSL limit, damage level
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 34. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note
AN10365
“Surface mount reflow soldering description”.
18. Abbreviations
Table 33.
Acronym
BCD
CDM
CMOS
ESD
HBM
I
2
C
IC
LSB
MSB
MSL
PCB
POR
RTC
SCL
SDA
SMD
Abbreviations
Description
Binary Coded Decimal
Charged-Device Model
Complementary Metal Oxide Semiconductor
ElectroStatic Discharge
Human Body Model
Inter-Integrated Circuit
Integrated Circuit
Least Significant Bit
Most Significant Bit
Moisture Sensitivity Level
Printed-Circuit Board
Power-On Reset
Real-Time Clock
Serial CLock line
Serial DAta line
Surface Mount Device
PCF8563
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 9 — 16 June 2011
40 of 45
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