PCF8563
NXP Semiconductors
Real-time clock/calendar
DIP8: plastic dual in-line package; 8 leads (300 mil)
SOT97-1
D
M
E
A
2
A
A
1
L
c
w M
Z
b
1
e
(e )
1
M
H
b
b
2
8
5
pin 1 index
E
1
4
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
(1)
Z
A
A
A
2
(1)
(1)
1
w
UNIT
mm
b
b
b
c
D
E
e
e
L
M
M
H
1
2
1
E
max.
min.
max.
max.
1.73
1.14
0.53
0.38
1.07
0.89
0.36
0.23
9.8
9.2
6.48
6.20
3.60
3.05
8.25
7.80
10.0
8.3
4.2
0.51
3.2
2.54
0.1
7.62
0.3
0.254
0.01
1.15
0.068 0.021 0.042 0.014
0.045 0.015 0.035 0.009
0.39
0.36
0.26
0.24
0.14
0.12
0.32
0.31
0.39
0.33
inches
0.17
0.02
0.13
0.045
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-13
SOT97-1
050G01
MO-001
SC-504-8
Fig 31. Package outline SOT97-1 (DIP8) of PCF8563P
PCF8563
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 9 — 16 June 2011
35 of 45
NXP [ NXP ]
