LPC546xx
NXP Semiconductors
32-bit ARM Cortex-M4 microcontroller
3. Ordering information
Table 1.
Ordering information
Type number
Package
Name
Description
Version
LPC54605J256ET180 TFBGA180 thin fine-pitch ball grid array package; 180 balls; body 12 ´ 12 ´ 0.8 mm
LPC54605J512ET180 TFBGA180 thin fine-pitch ball grid array package; 180 balls; body 12 ´ 12 ´ 0.8 mm
LPC54605J256BD100 LQFP100 plastic low profile quad flat package; 100 leads; body 14 14 1.4 mm
LPC54605J512BD100 LQFP100 plastic low profile quad flat package; 100 leads; body 14 14 1.4 mm
SOT570-3
SOT570-3
SOT407-1
SOT407-1
SOT926-1
LPC54605J256ET100 TFBGA100 plastic thin fine-pitch ball grid array package; 100 balls; body 9 9 0.7
mm
LPC54605J512ET100 TFBGA100 plastic thin fine-pitch ball grid array package; 100 balls; body 9 9 0.7
SOT926-1
SOT926-1
mm
LPC54606J256ET100 TFBGA100 plastic thin fine-pitch ball grid array package; 100 balls; body 9 9 0.7
mm
LPC54606J256BD100 LQFP100 plastic low profile quad flat package; 100 leads; body 14 14 1.4 mm
SOT407-1
SOT570-3
SOT926-1
LPC54606J256ET180 TFBGA180 thin fine-pitch ball grid array package; 180 balls; body 12 ´ 12 ´ 0.8 mm
LPC54606J512ET100 TFBGA100 plastic thin fine-pitch ball grid array package; 100 balls; body 9 9 0.7
mm
LPC54606J512BD100 LQFP100 plastic low profile quad flat package; 100 leads; body 14 14 1.4 mm
LPC54606J512BD208 LQFP208 plastic low profile quad flat package; 208 leads; body 28 28 1.4 mm
LPC54607J256ET180 TFBGA180 thin fine-pitch ball grid array package; 180 balls; body 12 ´ 12 ´ 0.8 mm
LPC54607J512ET180 TFBGA180 thin fine-pitch ball grid array package; 180 balls; body 12 ´ 12 ´ 0.8 mm
LPC54607J256BD208 LQFP208 plastic low profile quad flat package; 208 leads; body 28 28 1.4 mm
LPC54608J512ET180 TFBGA180 thin fine-pitch ball grid array package; 180 balls; body 12 ´ 12 ´ 0.8 mm
LPC54608J512BD208 LQFP208 plastic low profile quad flat package; 208 leads; body 28 28 1.4 mm
LPC54616J256ET180 TFBGA180 thin fine-pitch ball grid array package; 180 balls; body 12 ´ 12 ´ 0.8 mm
SOT407-1
SOT459-1
SOT570-3
SOT570-3
SOT459-1
SOT570-3
SOT459-1
SOT570-3
SOT926-1
LPC54616J512ET100 TFBGA100 plastic thin fine-pitch ball grid array package; 100 balls; body 9 9 0.7
mm
LPC54616J512BD100 LQFP100 plastic low profile quad flat package; 100 leads; body 14 14 1.4 mm
LPC54616J512BD208 LQFP208 plastic low profile quad flat package; 208 leads; body 28 28 1.4 mm
LPC54618J512ET180 TFBGA180 thin fine-pitch ball grid array package; 180 balls; body 12 ´ 12 ´ 0.8 mm
LPC54618J512BD208 LQFP208 plastic low profile quad flat package; 208 leads; body 28 28 1.4 mm
LPC54628J512ET180 TFBGA180 thin fine-pitch ball grid array package; 180 balls; body 12 ´ 12 ´ 0.8 mm
SOT407-1
SOT459-1
SOT570-3
SOT459-1
SOT570-3
LPC546xx
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2018. All rights reserved.
Product data sheet
Rev. 2.5 — 20 June 2018
5 of 169
NXP [ NXP ]
