LPC540xx
NXP Semiconductors
32-bit ARM Cortex-M4 microcontroller
15. Soldering
Footprint information for reflow soldering of LQFP208 package
SOT459-1
Hx
Gx
(0.125)
P2
P1
Hy Gy
By
Ay
C
D2 (8×)
D1
Bx
Ax
Generic footprint pattern
Refer to the package outline drawing for actual layout
solder land
occupied area
DIMENSIONS in mm
P1 P2 Ax
Ay
Bx
By
C
D1
D2
Gx
Gy
Hx
Hy
0.500 0.560 31.300 31.300 28.300 28.300 1.500 0.280 0.400 28.500 28.500 31.550 31.550
sot459-1_fr
Fig 55. Reflow soldering of the LQFP208 package
LPC540xx
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© NXP Semiconductors N.V. 2018. All rights reserved.
Product data sheet
Rev. 1.8 — 22 June 2018
158 of 168
NXP [ NXP ]
