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LPC2220FBD144 参数 Datasheet PDF下载

LPC2220FBD144图片预览
型号: LPC2220FBD144
PDF下载: 下载PDF文件 查看货源
内容描述: 16位/ 32位ARM微控制器;毛边,用10位ADC和外部存储器接口 [16/32-bit ARM microcontrollers; flashless, with 10-bit ADC and external memory interface]
分类和应用: 存储微控制器
文件页数/大小: 50 页 / 259 K
品牌: PHILIPS [ NXP SEMICONDUCTORS ]
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NXP Semiconductors
LPC2210/2220
16/32-bit ARM microcontrollers
I
I
I
I
I
I
I
I
I
N
LPC2210/01 and LPC2220 only: UART0/1 include fractional baud rate generator,
auto-bauding capabilities, and handshake flow-control fully implemented in
hardware.
Vectored Interrupt Controller (VIC) with configurable priorities and vector addresses.
Configurable external memory interface with up to four banks, each up to 16 MB and
8/16/32-bit data width.
Up to 76 general purpose pins (5 V tolerant) capable. Up to nine edge/level sensitive
external interrupt pins available.
N
LPC2210/01 and LPC2220 only: Fast GPIO ports enable port pin toggling up to 3.5
times faster than the original device. They also allow for a port pin to be read at any
time regardless of its function.
60 MHz (LPC2210) and 75 MHz (LPC2210/01 and LPC2220) maximum CPU clock
available from programmable on-chip Phase-Locked Loop (PLL) with settling time of
100
µs.
On-chip integrated oscillator operates with external crystal in range of 1 MHz to
25 MHz and with external oscillator up to 25 MHz.
Power saving modes include Idle and Power-down.
Processor wake-up from Power-down mode via external interrupt.
Individual enable/disable of peripheral functions for power optimization.
Dual power supply:
N
CPU operating voltage range of 1.65 V to 1.95 V (1.8 V
±
0.15 V).
N
I/O power supply range of 3.0 V to 3.6 V (3.3 V
±
10 %) with 5 V tolerant I/O pads.
16/32-bit ARM7TDMI-S processor.
3. Ordering information
Table 1.
Ordering information
Package
Name
LPC2210FBD144
LQFP144
Description
plastic low profile quad flat package; 144
leads; body 20
×
20
×
1.4 mm
plastic low profile quad flat package; 144
leads; body 20
×
20
×
1.4 mm
plastic low profile quad flat package; 144
leads; body 20
×
20
×
1.4 mm
plastic thin fine-pitch ball grid array package;
144 balls; body 12
×
12
×
0.8 mm
plastic thin fine-pitch ball grid array package;
144 balls; body 12
×
12
×
0.8 mm
Version
SOT486-1
SOT486-1
SOT486-1
SOT569-2
SOT569-2
Type number
LPC2210FBD144/01 LQFP144
LPC2220FBD144
LPC2220FET144
LPC2220FET144/G
LQFP144
TFBGA144
TFBGA144
LPC2210_2220_6
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 06 — 11 December 2008
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