NXP Semiconductors
BC847BS
45 V, 100 mA NPN/NPN general-purpose transistor
10. Soldering
2.65
solder lands
2.35 1.5
0.6 0.5
(4×) (4×)
0.4 (2×)
solder resist
solder paste
0.5
(4×)
0.6
(4×)
1.8
0.6
(2×)
occupied area
Dimensions in mm
sot363_fr
Fig 11. Reflow soldering footprint SOT363 (SC-88)
1.5
solder lands
4.5
0.3 2.5
solder resist
occupied area
1.5
Dimensions in mm
preferred transport
direction during soldering
1.3
2.45
5.3
1.3
sot363_fw
Fig 12. Wave soldering footprint SOT363 (SC-88)
BC847BS_3
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 03 — 18 February 2009
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