NXP Semiconductors
BAS16 series
High-speed switching diodes
4.4
4
2.9
1.6
solder lands
solder resist
2.1 1.6
1.1 1.2
solder paste
occupied area
1.1
(2×)
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 19. Reflow soldering footprint BAS16H (SOD123F)
3.05
2.2
2.1
solder lands
solder resist
1.65 0.95
0.5 (2×)
0.6 (2×)
solder paste
occupied area
0.5
(2×)
0.6
(2×)
Dimensions in mm
sod323f_fr
Reflow soldering is the only recommended soldering method.
Fig 20. Reflow soldering footprint BAS16J (SOD323F)
BAS16_SER_5
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 05 — 25 August 2008
12 of 20
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