PRODUCT DOCUMENTATION AND SOFTWARE
Refer to the following documents and software to aid your design process.
Application Notes
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AN1907: Solder Reflow Attach Method for High Power RF Devices in Plastic Packages
AN1955: Thermal Measurement Methodology of RF Power Amplifiers
AN1977: Quiescent Current Thermal Tracking Circuit in the RF Integrated Circuit Family
AN1987: Quiescent Current Control for the RF Integrated Circuit Device Family
AN3263: Bolt Down Mounting Method for High Power RF Transistors and RFICs in Over--Molded Plastic Packages
AN3789: Clamping of High Power RF Transistors and RFICs in Over--Molded Plastic Packages
Engineering Bulletins
EB212: Using Data Sheet Impedances for RF LDMOS Devices
Software
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Electromigration MTTF Calculator
For Software, do a Part Number search at http://www.freescale.com, and select the “Part Number” link. Go to the Software &
Tools tab on the part’s Product Summary page to download the respective tool.
REVISION HISTORY
The following table summarizes revisions to this document.
Revision
Date
Description
0
1
2
Sept. 2008
Jan. 2009
May 2011
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Initial Release of Data Sheet
Added Fig. 13, MTTF versus Junction Temperature, p. 8
Modified data sheet to reflect RF Test Reduction described in Product and Process Change Notification
number, PCN13628, p. 1, 3
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Fig. 3, Test Circuit Schematic, Z--list, changed Z13, Z14 from 0.564″ x 0.083″ Microstrip to 1.042″ x
0.083″ Microstrip, p. 4
Fig. 18, Test Circuit Schematic, Z--list, changed Z11, Z12 from 0.564″ x 0.083″ Microstrip to 1.042″ x
0.083″ Microstrip, p. 13
Changed ESD Human Body Model rating from Class 1B to Class 0 to reflect recent ESD test results of the
device, p. 2
Fig. 13, MTTF versus Junction Temperature removed, p. 8. Refer to the device’s MTTF Calculator
available at freescale.com/RFpower. Go to Design Resources > Software and Tools.
Updated Fig. 14, CCDF W--CDMA IQ Magnitude Clipping, Single--Carrier Test Signal to better represent
production test signal, p. 8 (renumbered as Fig. 13 after Fig. 13 removed)
Updated Fig. 15, Single--Carrier W--CDMA Spectrum to show the undistorted input test signal, p. 8
(renumbered as Fig. 14 after Fig. 13 removed)
Added AN3789, Clamping of High Power RF Transistors and RFICs in Over--Molded Plastic Packages to
Product Documentation, Application Notes, p. 26
Added Electromigration MTTF Calculator availability to Product Software, p. 26
MW7IC2220NR1 MW7IC2220GNR1 MW7IC2220NBR1
RF Device Data
Freescale Semiconductor
26
NXP [ NXP ]
