PRODUCT DOCUMENTATION, SOFTWARE AND TOOLS
Refer to the following resources to aid your design process.
Application Notes
AN1908: Solder Reflow Attach Method for High Power RF Devices in Air Cavity Packages
AN1955: Thermal Measurement Methodology of RF Power Amplifiers
Engineering Bulletins
EB212: Using Data Sheet Impedances for RF LDMOS Devices
Software
Electromigration MTTF Calculator
RF High Power Model
.s2p File
Development Tools
Printed Circuit Boards
To Download Resources Specific to a Given Part Number:
1. Go to http://www.nxp.com/RF
2. Search by part number
3. Click part number link
4. Choose the desired resource from the drop down menu
REVISION HISTORY
The following table summarizes revisions to this document.
Revision
Date
Description
0
1
May 2017
Jan. 2018
Initial release of data sheet
Added part number AFV10700GS, p. 1
Production test fixture, Typical Characteristic graphs: clarified temperature condition, p. 10
Added NI--780GS--4L package isometric, p. 1, and Mechanical Outline, pp. 16–17
AFV10700H AFV10700HS AFV10700GS
RF Device Data
NXP Semiconductors
18
NXP [ NXP ]
