PRODUCT DOCUMENTATION, SOFTWARE AND TOOLS
Refer to the following documents, software and tools to aid your design process.
Application Notes
AN1907: Solder Reflow Attach Method for High Power RF Devices in Plastic Packages
AN1955: Thermal Measurement Methodology of RF Power Amplifiers
AN3789: Clamping of High Power RF Transistors and RFICs in Over--Molded Plastic Packages
Engineering Bulletins
EB212: Using Data Sheet Impedances for RF LDMOS Devices
Software
Electromigration MTTF Calculator
RF High Power Model
.s2p File
Development Tools
Printed Circuit Boards
For Software and Tools, do a Part Number search at http://www.freescale.com, and select the “Part Number” link. Go to the
Software & Tools tab on the part’s Product Summary page to download the respective tool.
REVISION HISTORY
The following table summarizes revisions to this document.
Revision
Date
Description
0
1
Apr. 2013
Nov. 2013
Initial Release of Data Sheet
Upper frequency limit changed from 2690 to 2700 MHz to reflect measurement data, p. 1
Table 2, Thermal Characteristics: changed 2170 to 2140 MHz to reflect recent thermal test results, p. 2
Table 5, Electrical Characteristics, Load Mismatch: updated VSWR power levels (8 W CW to 14 W CW,
7 W CW to 12 W CW) to reflect recent characterization data test results, p. 3
Table 5, Electrical Characteristics, Typical Performance: changed P1dB from 7 W to 16.2 W based on
P3dB load pull calculations, p. 3
Figs. 2, 8, 12, Test Circuit Component Layout: added MTL number, pp. 4, 7, 9
Tables 6, 7, 8, Test Circuit Component Designations and Values: updated PCB description to reflect most
current board specifications from Rogers and added MTL part number, pp. 4, 7, 9
AFT20S015NR1 AFT20S015GNR1
RF Device Data
Freescale Semiconductor, Inc.
17
NXP [ NXP ]
