NXP Semiconductors
74LVC1G32
Single 2-input OR gate
13. Package outline
TSSOP5: plastic thin shrink small outline package; 5 leads; body width 1.25 mm
SOT353-1
D
E
A
X
c
y
HE
v
M
A
Z
5
4
A2
A1
(A3)
θ
A
1
e
e1
bp
3
w
M
detail X
Lp
L
0
1.5
scale
3 mm
DIMENSIONS (mm are the original dimensions)
UNIT
mm
A
max.
1.1
A1
0.1
0
A2
1.0
0.8
A3
0.15
bp
0.30
0.15
c
0.25
0.08
D
(1)
2.25
1.85
E
(1)
1.35
1.15
e
0.65
e1
1.3
HE
2.25
2.0
L
0.425
Lp
0.46
0.21
v
0.3
w
0.1
y
0.1
Z
(1)
0.60
0.15
θ
7°
0°
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
OUTLINE
VERSION
SOT353-1
REFERENCES
IEC
JEDEC
MO-203
JEITA
SC-88A
EUROPEAN
PROJECTION
ISSUE DATE
00-09-01
03-02-19
Fig 9. Package outline SOT353-1 (TSSOP5)
74LVC1G32_6
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 06 — 2 August 2007
8 of 14
PHILIPS [ NXP SEMICONDUCTORS ]
