Philips Semiconductors
Product specification
Quad 2-input AND gate
74HC08; 74HCT08
handbook, halfpage
handbook, halfpage
1A
1
VCC
14
13
12
4B
4A
4Y
3B
3A
1A
1B
1Y
2A
2B
2Y
GND
1
2
3
4
5
6
7
MNA220
14 VCC
13 4B
12 4A
1B
1Y
2A
2B
2Y
2
3
4
5
6
7
Top view
GND
8
3Y
08
11 4Y
10 3B
9
3A
GND
(1)
11
10
9
8 3Y
MCE183
(1) The die substrate is attached to this pad using conductive die
attach material. It can not be used as a supply pin or input.
Fig.1
Pin configuration DIP14, SO14 and
(T)SSOP14.
Fig.2 Pin configuration DHVQFN14.
handbook, halfpage
handbook, halfpage
1
2
&
3
1
2
4
5
9
10
12
13
1A
1B
2A
2B
3A
3B
4A
4B
1Y
3
4
&
6
2Y
6
5
3Y
8
9
10
&
8
4Y
11
12
MNA222
&
11
13
MNA223
Fig.3 Logic symbol.
Fig.4 IEC logic symbol.
2003 Jul 25
4