NXP Semiconductors
74HC02; 74HCT02
Quad 2-input NOR gate
TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm
SOT402-1
D
E
A
X
c
y
H
E
v
M
A
Z
14
8
Q
A
2
pin 1 index
A
1
θ
L
p
L
(A
3
)
A
1
e
b
p
7
w
M
detail X
0
2.5
scale
5 mm
DIMENSIONS (mm are the original dimensions)
UNIT
mm
A
max.
1.1
A
1
0.15
0.05
A
2
0.95
0.80
A
3
0.25
b
p
0.30
0.19
c
0.2
0.1
D
(1)
5.1
4.9
E
(2)
4.5
4.3
e
0.65
H
E
6.6
6.2
L
1
L
p
0.75
0.50
Q
0.4
0.3
v
0.2
w
0.13
y
0.1
Z
(1)
0.72
0.38
θ
8
o
0
o
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT402-1
REFERENCES
IEC
JEDEC
MO-153
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-18
Fig 11. Package outline SOT402-1 (TSSOP14)
74HC_HCT02_3
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 03 — 18 September 2008
11 of 15
PHILIPS [ NXP SEMICONDUCTORS ]
